The thin diamond grinding wheel adopts a unique process, which combines the selected diamond powder with metal. It can slot and cut all kinds of hard brittle materials, such as: all kinds of silicon chips, germanium, glass, ferrite, lithium niobate, lithium tantalate, gallium phosphide, gallium arsenide, gallium phosphorus arsenide, ceramics, etc. It has the characteristics of strong toughness, high precision and super-thin.

Super-thin diamond series grinding wheel is a thin ring. Must choose the right size of the flange can be used, after the use of such as the edge wear or the whole ring of the edge was knocked out, can replace the smaller flange can continue to use after dressing, very economical. As long as the precise flange is used, the best cutting effect can be obtained.

Conditions of use:

1. The cutting linear speed of the grinding wheel must be greater than 80 m/s;

2. The normal cutting speed of the grinding wheel (the moving speed of the cut) is determined according to the requirements of cutting materials and cutting accuracy, generally within 0.5-200 mm/second;

3. The grinding wheel must be cooled with water when cutting, and the cooling water flow shall not be less than 2.4 litres/min;

4. The cutting depth of the grinding wheel is determined according to the thickness of the grinding wheel and the cutting material. Generally, the maximum cutting depth is within 3 mm.

5. When selecting the grinding wheel, in order to ensure the best cutting effect, the grinding wheel with the corresponding abrasive particle size should be selected according to the different cutting materials.

6. The cutting edge of the new grinding wheel must be corrected with a special correction board before use.